Comparison ledger
Denton Vacuum Discovery Cathode, Perkin Elmer PE 4400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Discovery CathodeDenton Vacuum | PE 4400Perkin Elmer |
|---|---|---|
| OEM | Denton Vacuum | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum Discovery | Perkin Elmer PE 4400 |
| Specifications | ||
| Configuration | 12.0" sputtering system with planetary Load lock and robot loading assemblies[2] | Not operational[4] |
| Sputtering system size | 12.0 inch[2] | — |
| Chamber dimensions | Approx. 4' X 6' X 12" Stainless Steel Chamber[2] | — |
| Ion source | Veeco 5 cm Gridded Ion Source with Gas Controls[3] | — |
| High vacuum pump | CTI Cryogenics High Vacuum Pump/Blanket Heater[2] | — |
| Cryopump | Torr400 Cryopump with Oxford E500 Dual Temperature Monitor[2] | — |
| Turbo molecular pump | KYKY F400 Turbo Molecular Pump with FV-LII Pump Controller[2] | — |
| Compressor | CTI-Cryogenics 9600 Compressor[2] | — |
| DC power supplies | (4) Advance Energy Pinnacle plus DC Power Supplies[3] | — |
| Cathodes | (4) 12" Cathodes[2] | — |
| Robot | Loader/Unloader with Epson G6-453c Robot, Vintage 9/10[2] | — |
| Controller | Ion Tech Mps-3000 fc Controller[2] | — |
| Load lock | Load Lock Loader with PLC Controller[2] | — |
| Gate valve | Vat Gate Valve[2] | — |
| Adaptive pressure controller | Vat Adaptive Pressure Controller[2] | — |
| Pressure monitors | Assorted Pressure Monitors[2] | — |
| Isolation valves | Isolation Valves[2] | — |
| Power supply/control | Stand Alone Power Supply/Control[2] | — |
| Computer system | Computer System with Related Hardware/Software[2] | — |
| Manufacturer | Denton Vacuum[2] | — |
| Model | Discovery Cathode[2] | PE 4400[4] |
| Category | Deposition[3] | Deposition[5] |
| Process type | Sputtering system[3] | — |
| Wafer size | 12.0-inch[3] | — |
| Wafer handling | Planetary load lock and robot loading assemblies[3] | — |
| Chamber | Approx. 4' x 6' x 12" stainless steel chamber[2] | — |
| Vacuum pumps | CTI Cryogenics high vacuum pump/blanket heater; Torr400 cryopump with Oxford E500 dual temperature monitor; KYKY F400 turbo molecular pump with FV-LII pump controller[2] | — |
| Pressure control | Vat gate valve and Vat adaptive pressure controller[2] | — |
| Control system | Ion Tech Mps-3000 fc controller; stand alone power supply/control; computer system with related hardware/software[2] | — |
| Robot loader/unloader | Epson G6-453c robot[2] | — |
| Make | — | Perkin Elmer[4] |
| Equipment type | — | Sputtering System[4] |
| Cathode shape | — | Circular[1] |
| Cathode size | — | 8 inch[1] |
| Cathode port amount | — | 1 to 4[1] |
| Cathode / sputter type | — | RF Magnetron[1] |
| DC power supply | — | 1-5 KW[1] |
| RF power supply | — | 1-2 KW[1] |
| Process gas | — | Argon (200 SCCM) standard[1] |
| Gas lines | — | Up to 3 gas lines, MFC customized[1] |
| Substrate size | — | Small to 6 inch[1] |
| Wafer load | — | Manually load, capable of limited automatic operation[1] |
| Throughput per batch | — | 3 inch wafer, 30 pieces; 4 inch wafer, 13 pieces; 5 inch wafer, 9 pieces; 6 inch wafer, 7 pieces[1] |
| Sputter rate | — | 20 to 500 Angstroms/kw-min depending on model, cathode, process, sputter material, etc.[1] |
| Uniformity capacity | — | ±7%~10%[1] |
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