Comparison ledger
Cascade Microtech 103-754, Electroglas EG5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 103-754Cascade Microtech | EG5Electroglas |
|---|---|---|
| OEM | Cascade Microtech | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | 6-inch diameter microchamber and thermal chuck | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Cascade Microtech 103-754 | Electroglas EG5 |
| Cited variants | — | |
| Specifications | ||
| type | x-y-z-θ probe positioner[2] | — |
| installed on | HFTL 50-GHz Small-Signal Probe Station[2] | — |
| quantity in station | two[2] | — |
| station chuck size | 6-inch-diameter microchamber and thermal chuck[2] | — |
| Quantity per station | Two positioners[2] | — |
| Chuck size | 6-inch-diameter microchamber and thermal chuck[2] | — |
| Temperature range | -50 to 200 °C[2] | — |
| Product line | — | EG5|300[1] |
| Variant | — | ARGOS[1] |
| Description | — | Electroglas' highest accuracy 300mm wafer prober[1] |
| Probe-to-pad accuracy | — | ±2.5 micron[1] |
| Stepping accuracy | — | 1.0 micron[1] |
| Wafer sizes handled | — | 150mm, 200mm, and 300mm wafers[1] |
| Variant description | — | Fine-pitch probing for in-line parametric test structures[1] |
| Tool type | — | wafer prober[1] |
| Accuracy positioning | — | probe-to-pad accuracy of ±2.5 micron[1] |
| Handled wafer sizes | — | 150mm, 200mm, 300mm[1] |
| Model relation | — | EG5|300e is a fine-pitch probing model for in-line parametric test structures[1] |
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