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Comparison ledger

017-0146-01 PrealignerversusACS 200 Gen 3

Brooks 017-0146-01 Prealigner, SUSS MicroTec ACS 200 Gen 3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS 200 Gen 3SUSS MicroTec
OEMBrooksSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0146-01 PrealignerSUSS MicroTec ACS 200
Cited variants—
  • ACS 200 Gen 3 Coater/DeveloperGen 3[1]
Specifications
Set-up Transformer—50 Hz Compatible Model[2]
Cassette Stations (4)—Compatible with Open Cassettes[2]
Wafer Transfer System—Dual-Arm (Nidec Sankyo) End Effector[2]
Pre-Aligner—Equipped with Orientation flat/notch postition rotation for both opague (Si water) & transparent (glass water)substrates[2]
Configuration—Bake Plate (8):[2]
Temp—60-250 Deg C[2]
Vintage—2019
Coaters & Developers Vintage—2019
- # of develop line each bowl—2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2
Wafer Sizes—2, 3, 4, 5, 6, 8, 12 inch[2]
Max Wafer Size (product detail)—up to 8 inch[2]
Cassette Stations—4 (compatible with Open Cassettes)[2]
Bake Plates—8, supports proximity bake, temperature 60-250 °C[2]
Cool Plates—3, temperature 18-25 °C, proximity supported[2]
Configuration (variant)—Coater/Developer with 4 developers, 4D setup[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing