Comparison ledger
Branson 101-149-053 Gold Booster, EV Group 850 SOI Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 850 SOI WaferEV Group |
|---|---|---|
| OEM | Branson | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | EV Group 850 |
| Specifications | ||
| Configuration | 1:1.5[1] | Fully-Automatic[4] |
| Manufacturer | Branson[2] | EV Group[5] |
| Model | 101-149-053[2] | 850 SOI Wafer[4] |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Wafer size | — | Suitable for wafer sizes up to 6"/150mm wafers[4] |
| Category | — | Packaging & Bonding[5] |
| Operating mode | — | Fully-Automatic[4] |
| Maximum wafer size | — | up to 6"/150mm wafers[4] |
| Current configuration | — | configured for 6"/150mm wafers[4] |
| Robot | — | One Genmark Robot with pre-aligner[4] |
| Cleaning modules | — | Two Cleaning Modules[4] |
| Bonding station | — | One bonding station with high vacuum[4] |
| Pre-aligner | — | Mechanical pre-aligner on bond station (pneumatically actuated)[4] |
| Control interface | — | PC controlled with Windows-based graphical user interface[4] |
| Access control | — | Password protected access levels[4] |
| Cleaning control | — | Programmable rotational speed for substrate cleaning[4] |
| Cleaning option | — | Megasonic cleaning option[4] |
| Vintage | — | 2000[6] |
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