Comparison ledger
Besi 2200 EVO Flexible Multi-Chip, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | |
|---|---|---|
| OEM | Besi | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer Table | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | West Bond 10490 |
| Specifications | ||
| Wafer size | Wafer Table[1] | — |
| Configuration | Tool Changer Unit 7 Slots[2] | — |
| OEM | Besi / Datacon[2] | — |
| Model | 2200 EVO Flexible Multi-Chip[2] | 10490[3] |
| Category | Packaging & Bonding[1] | — |
| Vacuum | Internal Vacuum Pump[1] | — |
| Tool changer | Unit 7 Slots[2] | — |
| Main unit | Musashi Super Sigma V2[2] | — |
| Axis component | P-part at Main AXIS[2] | — |
| Optics | Microscope[2] | — |
| Adapter | 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4")[2] | — |
| WP-adapter | 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT)[2] | — |
| GP-adapter | 2" GP-Adapter - (12"-FF123) - 22 up - (any WT)[2] | — |
| Manufacturer | — | West Bond[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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