Waferpedia

Comparison ledger

200 ACUversusMACS ICP

Axcelis 200 ACU, SPTS MACS ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisSPTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200SPTS MACS ICP
Cited variants—
Specifications
ConfigurationParts Machine[2]HR chamber[6]
ManufacturerAxcelis[2]SPTS / STS[6]
Model200 ACU[2]MACS ICP[6]
Tool typeAsher[2]—
Wafer size200mm[4]8 inch[6]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
Clamp type—standard WTC[6]
Coil RF power—Advanced Energy RFG3001, 3kw[6]
Platen RF power—ENI ACG-3B 13.56MHZ, 300w[6]
Load lock pump—Ebara AAL10[6]
Chamber pump—Ebara A30W[6]
Turbo pump—Leybold MAG2000CT[6]
Turbo Pump Controller—Leybold MAG Drive 2000[6]
Chiller—ATS/DEX-20ADI[6]
Category—Etch[7]
Chamber—HR chamber[6]
Wafer capability—6", 8" capable[6]
Wafer handling—MACS loader for cassette to cassette operation (2 load stations)[6]
Vacuum load lock—Carousel vacuum load lock[6]
Backside cooling—Helium backside cooling (HBC)[6]
Gases—C4F8 (200 sccm); SF6 (1000 sccm); O2 (200 sccm); Ar (50 sccm)[6]
Vintage—2002[6]
Voltage—208 Volts / 60 Hz, 40 Amps/phase[1]
Chamber quantity—1 chamber[8]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]hommer.com.twhommer.com.tw
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]inventory listing
  7. [7]waferpedia.comwaferpedia.com
  8. [8]challentech.com.twchallentech.com.tw