Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, KLA RS 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | RS 100KLA |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | KLA RS 100 |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Wafer size range | — | 2 to 12 inch[3] |
| Measurement type | — | Sheet resistance (four-point probe)[3] |
| Measurement range | — | >5 mΩ/sq to <5 MΩ/sq[3] |
| Absolute accuracy | — | ±1% of certified value (NIST traceable, corrected to 23°C)[3] |
| Measurement repeatability | — | <0.2% (1σ) at 1σ test diameter with appropriate probe head[3] |
| Reproducibility (metals) | — | <0.5% for Cu, W, TiN[3] |
| Edge exclusion | — | 1 mm from edge of conductive film[3] |
| Sites programmable (routine) | — | 1 to 30 sites (ASTM standard tests included)[3] |
| Sites programmable (mapping) | — | Up to 1,200 sites (XY maps and user-defined patterns)[3] |
| Wafer loading | — | Manual, open cassette (200/300mm)[3] |
| Wafer aligner | — | High-speed, on-stage optical aligner with CCD and ring illuminator[3] |
| Probe head types | — | Type A, B, C, D, E, F, H (one precision probe head)[3] |
| Computer system | — | Pentium III with keyboard and trackball[3] |
| Operating system | — | Windows NT[3] |
| Software version | — | 2.31[3] |
| AC voltage | — | 200–240 VAC[3] |
| Vacuum requirement | — | Min 25 inHg[3] |
| Air supply | — | 80–100 PSI[3] |