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Comparison ledger

0010-16392 ESC AssemblyversusDPS II CIP

Applied Materials 0010-16392 ESC Assembly, Applied Materials DPS II CIP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
DPS II CIPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials DPS
Specifications
OEMApplied Materials[1]Applied Materials[3]
Model0010-16392[1]DPS II CIP[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—4x (D4) SILICON DPS II chamber, 12 Gas line (Standard Gas Line)[3]
Applicable—2 Chiller[3]
Not applicable—Scrubber, Dry Pump[3]
Category—Etch[4]
Tool type—Etcher[4]
Chamber—4x (D4) SILICON DPS II chamber[3]
Gas line—12 Gas line (Standard Gas Line)[3]
Chiller—2 Chiller applicable[3]
Scrubber—Not applicable[3]
Dry pump—Not applicable[3]
Vintage—2005[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com