Comparison ledger
Applied Materials 0010-03254 E Chuck, KLA RS 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | RS 100KLA |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | KLA RS 100 |
| Specifications | ||
| Wafer size range | — | 2 to 12 inch[1] |
| Measurement type | — | Sheet resistance (four-point probe)[1] |
| Measurement range | — | >5 mΩ/sq to <5 MΩ/sq[1] |
| Absolute accuracy | — | ±1% of certified value (NIST traceable, corrected to 23°C)[1] |
| Measurement repeatability | — | <0.2% (1σ) at 1σ test diameter with appropriate probe head[1] |
| Reproducibility (metals) | — | <0.5% for Cu, W, TiN[1] |
| Edge exclusion | — | 1 mm from edge of conductive film[1] |
| Sites programmable (routine) | — | 1 to 30 sites (ASTM standard tests included)[1] |
| Sites programmable (mapping) | — | Up to 1,200 sites (XY maps and user-defined patterns)[1] |
| Wafer loading | — | Manual, open cassette (200/300mm)[1] |
| Wafer aligner | — | High-speed, on-stage optical aligner with CCD and ring illuminator[1] |
| Probe head types | — | Type A, B, C, D, E, F, H (one precision probe head)[1] |
| Computer system | — | Pentium III with keyboard and trackball[1] |
| Operating system | — | Windows NT[1] |
| Software version | — | 2.31[1] |
| AC voltage | — | 200–240 VAC[1] |
| Vacuum requirement | — | Min 25 inHg[1] |
| Air supply | — | 80–100 PSI[1] |