Accretech
W-GM-4200 Wafer Edge alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
DAD3221
150mm
Dicing & Grinding
The Disco DAD3221 is an automatic dicing saw for 100 mm and 150 mm wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Blanchard
22 AD 42
Dicing & Grinding
Disco
321
Dicing & Grinding
Disco 321 is a wafer dicing saw designed for dicing semiconductor wafers.
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