Waferpedia

Comparison ledger

UF 3000 LX Automatic Waferversus103-754

Accretech UF 3000 LX Automatic Wafer, Cascade Microtech 103-754, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
103-754Cascade Microtech
OEMAccretechCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer sizeWafer I.D Reading6-inch diameter microchamber and thermal chuck
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 3000Cascade Microtech 103-754
Specifications
ConfigurationRoom/hot chuck[1]—
Wafer sizeWafer I.D Reading[2]—
type—x-y-z-θ probe positioner[3]
installed on—HFTL 50-GHz Small-Signal Probe Station[3]
quantity in station—two[3]
station chuck size—6-inch-diameter microchamber and thermal chuck[3]
Quantity per station—Two positioners[3]
Chuck size—6-inch-diameter microchamber and thermal chuck[3]
Temperature range—-50 to 200 °C[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]cnf.cornell.educnf.cornell.edu