Universal Instruments

Pick-and-place machines use a gantry system with placement heads that move along beams to pick components from feeder tracks and place them onto circuit boards with precision. The placement heads may use vacuum nozzles to handle components.
In a surface-mount technology assembly line, the pick-and-place machine operates after solder paste has been applied to the circuit board and before the assembled board enters the reflow oven. The machine receives boards from an upstream conveyor and feeds them to a downstream conveyor after placement.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The following facts about the PEPP 1 DS 1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PEPP 1 DS 1 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PEPP 1 DS 1 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PEPP 1 DS 1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PEPP 1 DS 1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PEPP 1 DS 1 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Sep 22, 2026.
The Juki FX 3 RAL is a pick-and-place machine described with dual head, four tables, six segments per head, and 220 V / 60 Hz power.
The Juki KE 2060 RE is a pick-and-place SMT machine for small chip components, SOTs, and ICs.