Tokyo Electron
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The Tokyo Electron WDF Frame is a fully automatic dicing frame prober that can probe standard wafers and devices on a dicing frame without hardware change kits. The WDF Frame supports both wafer and dicing frame handling, enabling testing of thin wafers, diced dies, and advanced packages.[1]
The WDF 12DP+ variant uses a linear motor stage with XY probing accuracy of ±1.8 µm and Z accuracy of ±5.0 µm. The WDF 8 variant uses a ball screw stage with XY accuracy of ±4.0 µm. Both variants have Z probing accuracy of ±5.0 µm. The WDF 12DP+ has a probing force option of 200 or 300 kg, while the WDF 8 has a probing force of 60 kg. The WDF 12DP+ employs TEL's N-Shot alignment algorithm for diced wafer test.[1]
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| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| WDF 12DP+ | — | — | Latest dicing frame prober supporting 300mm wafers and 300mm dicing frames with no change kit; features N-Shot alignment, improved ESD capability, and optional 8-inch conversion kit for 200mm substrates. | tel.com[1] |
| WDF 8 | — | — | Supports 200mm wafers and 200mm dicing frames with ball screw stage, XY probing accuracy ±4.0 µm, Z probing accuracy ±5.0 µm, probing force 60 kg. | tel.com[1] |
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The WDF 12DP+ supports 200 mm and 300 mm wafers, as well as 300 mm dicing frames. With an optional 8 inch conversion kit, it also supports 200 mm dicing frames.[1]
The XY probing accuracy of the WDF 12DP+ is ±1.8 µm.[1]
The probing force of the WDF 8 is 60 kg.[1]
The WDF series uses TEL's unique N-Shot alignment algorithm for diced wafer test.[1]
The WDF 12DP+ uses Windows+PLC as its operating system.[1]
The Z probing accuracy is ±5.0 µm for both the WDF 12DP+ and WDF 8.[1]
The following facts about the WDF Frame are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the WDF Frame are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WDF Frame are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the WDF Frame are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the WDF Frame are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the WDF Frame is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.