Tokyo Electron
The Tokyo Electron TE 8500 PESC Dry is a dry etcher with one chamber. The TE 8500 PESC Dry performs oxide etch with endpoint capability. The TE 8500 PESC Dry uses process gases CF4, CHF3, and He.[1][2]
The Tokyo Electron TE 8500 PESC Dry sits in the pattern transfer portion of wafer processing, after a film has been deposited and patterned by lithography.
The Tokyo Electron TE 8500 PESC Dry removes oxide selectively as part of dry etch processing before later fabrication steps continue.
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The following facts about the TE 8500 PESC Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TE 8500 PESC Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TE 8500 PESC Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TE 8500 PESC Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TE 8500 PESC Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TE 8500 PESC Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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