Tokyo Electron
Tactras RLSA Process
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Tokyo Electron Tactras RLSA Process is an etch process chamber for 12-inch wafers. The Tactras RLSA Process is used for poly etch. The Tactras RLSA Process belongs to the Etch category.[1][2][3]
What it is
How it works
General reference — not yet source-verifiedRLSA stands for Radial Line Slot Antenna, a plasma source technology that couples microwave energy into the process chamber through a slotted antenna. The microwave plasma generated is typically high-density and uniform, enabling precise etch profiles. The Tactras RLSA chamber uses this principle to sustain a plasma for etching.
Where it fits in the process flow
General reference — not yet source-verifiedEtch tools are positioned in the semiconductor manufacturing flow after lithography and before deposition or cleaning steps. The Tactras RLSA Process Chamber is used in the etch module of a fabrication line, specifically for processing wafers that have been patterned with photoresist to define the etch regions.
What do the numbers mean?
Wafer handling1
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of materials can be etched with this class of system?General reference — not yet source-verified
Plasma etch systems can process a broad range of materials including silicon, polysilicon, silicon dioxide, silicon nitride, various metals (e.g., aluminum, copper, titanium, tungsten), and organic films such as photoresist. The specific gas chemistry and plasma conditions are chosen to achieve selective removal of the target material while minimizing attack on underlying or adjacent layers.
How is etch uniformity controlled across the wafer?General reference — not yet source-verified
Etch uniformity is managed through design of the plasma source, gas distribution, wafer temperature control, and chamber geometry. Systems may use multi-zone gas injection, tunable electrode temperature, and plasma confinement rings to ensure consistent etch rate and profile from wafer center to edge. Real-time endpoint detection and feedback loops further improve uniformity.
What causes pattern damage or defects during etching?General reference — not yet source-verified
Potential damage mechanisms include ion bombardment causing physical erosion or amorphization, charging effects leading to arcing, and reactive species causing unwanted corrosion or contamination. Over-etching can undercut the mask, while under-etching leaves residues. Proper process optimization—adjusting power, pressure, gas flow, and time—mitigates these issues.
What is the typical maintenance schedule for such systems?General reference — not yet source-verified
Maintenance intervals depend on process load, chemistry, and chamber cleanliness. Common tasks include cleaning chamber walls to remove polymer deposits, replacing worn components such as focus rings or electrodes, and calibrating sensors. Many systems incorporate self-cleaning cycles and predictive diagnostics to extend periods between major preventative maintenance.
Not publicly documented
The following facts about the Tactras RLSA Process are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Tactras RLSA Process are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Tactras RLSA Process are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Tactras RLSA Process are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Tactras RLSA Process are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Tactras RLSA Process is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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