Waferpedia

Tokyo Electron

P 12 XLn

Test & ProbeTokyo Electron P 12 family
Research Quality: 40% complete
P 12 XLn — Inventory photo
Fig. 01P 12 XLnInventory photo[1]

How it works

A prober is a piece of semiconductor test equipment that positions a wafer on a chuck and brings a probe card into contact with the die's pads to enable electrical testing. The P 12 XLn+ prober supports wafer sizes of eight and twelve inches.[7]

The P 12 XLn and P 12 XLn+ are configured for memory and logic test applications. The P 12 XLn+ may be used for memory testing.[2]

The P 12 XLn+ prober may be used for logic testing.[5]

The P 12 XLn models accept a rated power input of 208 V, 50/60 Hz, with a rated breaker input of 30 A and an ampere interrupt capacity of 35 kA.[1][2][5]

The P 12 XLn+ prober can include a nickel chuck top, a hot temperature controller, a GPIB interface, a WAPP option, a Combo350 interface, and a standard foul loader with standard upper and lower pincettes.[6]

Applications

The P 12 XLn+ prober is applied in testing logic devices.[5]

What do the numbers mean?

Power & electrical4

50/60 Hz[1]
Accurate?
Rated Power Input
208 V, 50/60 Hz[2]
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Frequency
50/60 Hz[1]
Accurate?
Power input
208 V, 50/60 Hz[2]
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Wafer handling3

12
Nickel Chuck Top[6]
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Standard Foub Loader[6]
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Wafer sizes
8, 12 inch[7]
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Control & software5

Hot Temp Controller[6]
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GPIB Interface[6]
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Combo350 Interface[6]
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Hot temp controller
Included[6]
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GPIB interface
Included[6]
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Configuration & options19

Rated Breaker Input
30 A[1]
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Ampere Interrupt Capacity
35 kA[1]
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May be used for memory[2]
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May be used for logic[5]
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WAPP Option[6]
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Standard Upper / Low Pincette[6]
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No SACC[6]
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D230 refrigeration[7]
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VIP 3 A[7]
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GPIB[7]
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Temp
-40 ~ 150 C[7]
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200 AC[8]
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Make
Tel[1]
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Model
P 12 XLn[1]
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Equipment type
Prober[7]
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Vintage
2005[1]
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Vintage
2007[2]
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Application note
May be used for memory[2]
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Application note
May be used for logic[5]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
P 12 XLn+—2006–2007Sources state different configurations, including wafer sizes 8 and 12 inch, GPIB interface, temperature range -40 ~ 150 C, and options such as Hot Temp Controller, WAPP Option, Combo350 Interface, Standard Foub Loader, Standard Upper / Low Pincette, and No SACC.Equipment inventory listing[7]
P 12 XLn+ Prober—2006–2007Sources distinguish 2006 and 2007 vintage entries; one entry says it may be used for logic, another says it may be used for memory, and one lists options including nickel chuck top, hot temp controller, GPIB interface, WAPP option, Combo350 interface, standard foub loader, standard upper / low pincette, and no SACC.Equipment inventory listing[6]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50/60 Hz[1]
  • Rated Power Input208 V, 50/60 Hz[2]
  • Frequency50/60 Hz[1]
  • Power input208 V, 50/60 Hz[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the P 12 XLn+ support?

8-inch and 12-inch.[7]

What are the power requirements of the P 12 XLn?

The P 12 XLn operates at 50/60 Hz with a rated breaker input of 30 A and an ampere interrupt capacity of 35 kA.[1]

What are the power requirements of the P 12 XLn+?

The P 12 XLn+ has a rated power input of 208 V, 50/60 Hz, and a rated breaker input of 30 A.[2][5][6]

What optional equipment is available for the P 12 XLn+?

Nickel chuck top, hot temperature controller, GPIB interface, WAPP option, Combo350 interface, standard foul loader, and standard upper and lower pincette.[6]

What applications is the P 12 XLn+ suited for?

Memory and logic device testing.[2][5]

Not publicly documented

The following facts about the P 12 XLn are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 12 XLn are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the P 12 XLn are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the P 12 XLn are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the P 12 XLn is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the P 12 XLn are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (10)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing
  9. [9]Equipment inventory listing
  10. [10]P-12XL/P-12XLn/P-12XLn+/P-12XLm | Tokyo Electron — tel.com (Jan 10, 2011)web.archive.org
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Last updated Oct 7, 2026.

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