Tokyo Electron
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Tokyo Electron Certas Wing is an etch equipment model.
An etch tool removes selected material from a wafer surface by exposing the surface to controlled process gases and process conditions.
Etch equipment sits in the wafer fabrication flow after pattern definition and before subsequent build or completion steps.
Etch tools are used to remove targeted films, clear selected layers, and shape patterned features on semiconductor wafers.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Certas Wing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Certas Wing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Certas Wing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Certas Wing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Certas Wing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Certas Wing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
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Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.