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Thermco

5200 Diffusion

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Thermco 5200 Diffusion Furnace is a diffusion furnace. Thermco 5200 Diffusion Furnace is specified for 6-inch wafers. Thermco 5200 Diffusion Furnace is configurable from two to four process chambers.[1][2]

5200 Diffusion — Inventory photo
Fig. 015200 DiffusionInventory photo[1]

What it is

The Thermco 5200 Diffusion Furnace is a configurable production-range system with two to four process chambers.[2]

The Thermco 5200 Diffusion Furnace is used for semiconductor substrates and related wafer-processing workloads.[2][1][3]

How it works

The Thermco 5200 Diffusion Furnace uses three independently controlled heating zones, isolated secondary-voltage power, zero-cross over full-phase SCR firing, balanced power loading, thermal safety circuits, and SCR cooling fans.[2][4]

The Thermco 5200 Diffusion Furnace can be controlled by the Thermco TMX controller and PCMUX system, with one MUX computer for recipe generation and status overview and one control computer per tube.[2][4]

Where it fits in the process flow

The Thermco 5200 Diffusion Furnace is configured for semiconductor, PV, LED, nano, and MEMS substrates up to 150 mm in diameter.[2][4]

The Thermco 5200 Diffusion Furnace can be interfaced with elevators and fully automatic cassette-to-cassette automation packages.[2][4]

Applications

The Thermco 5200 Diffusion Furnace is characterized for silicon nitride, low-stress silicon nitride, ramped-temperature polysilicon, uniform-grain polysilicon, TEOS, LTO, BPSG, high-temperature oxide, high-vacuum hydrogen anneal, dry oxide, wet oxide, POCl3 or BBr3, forming-gas anneal, high-temperature drive-in, alloy or low-temperature anneal, 100% hydrogen anneal, FGA anneal, CNT growth, and graphene growth.[2][4]

The Thermco 5200 Diffusion Furnace supports wafers up to 150 mm in diameter, and the 5200 series has a 1,100 mm flatzone.[2][4]

The Thermco 5200 Diffusion Furnace is used for processing semiconductor, PV, LED, nano, and MEMS substrates.[2][4]

What do the numbers mean?

Wafer handling3

Wafer size
6 inch[1]
Accurate?
Substrate diameter
Up to 150 mm[2]
Accurate?
Applications
Semiconductor, PV, LED, Nano, and MEMS substrates[2]
Accurate?

Control & software1

Control system
Thermco TMX controller[2]
Accurate?

Configuration & options7

Boron[3]
Accurate?
Make
Thermco[1]
Accurate?
Model
5200[1]
Accurate?
Process chambers
Two to four-process chamber systems[2]
Accurate?
Heating zones
3 independently controlled heating zones[2]
Accurate?
Operating temperature range
200°C to 1350°C[2]
Accurate?
Flatzone
1,100 mm[2]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What substrate size does the Thermco 5200 Diffusion Furnace support?

The Thermco 5200 Diffusion Furnace supports substrates up to 150 mm in diameter.[2][4]

How many process chambers can the Thermco 5200 Diffusion Furnace have?

The Thermco 5200 Diffusion Furnace is configurable from two to four process chambers.[2][4]

What heating-zone architecture does the Thermco 5200 Diffusion Furnace use?

The Thermco 5200 Diffusion Furnace uses three independently controlled heating zones.[2][4]

What automation interfaces are supported?

The Thermco 5200 Diffusion Furnace can be interfaced with elevators and fully automatic cassette-to-cassette automation packages.[2][4]

What processes are characterized for the Thermco 5200 Diffusion Furnace?

The Thermco 5200 Diffusion Furnace is characterized for silicon nitride, polysilicon, TEOS, LTO, BPSG, oxide, hydrogen anneal, oxide growth, POCl3 or BBr3, forming-gas anneal, drive-in, and CNT or graphene growth.[2][4]

Not publicly documented

The following facts about the 5200 Diffusion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5200 Diffusion are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 5200 Diffusion are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 5200 Diffusion are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 5200 Diffusion are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 5200 Diffusion is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]thermcosystems.com — thermcosystems.comthermcosystems.com
  3. [3]Inventory photo
  4. [4]THERMCO 5200 Furnace PLCVD ,Diffusion Furnace | SemiStar — semistarcorp.comsemistarcorp.com
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Last updated Oct 8, 2026.

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