Teradyne
Ultra Flex BB 512
The Teradyne Ultra Flex BB 512 is a semiconductor test and probe system. The Ultra Flex BB 512 defines its operation through a fixed slot configuration: Slot 0 uses GigaDig HD 2, Slot 4 uses HSS 6400, slots 6-9 and 14-17 use HSD-M, Slot 11 uses Turbo-Frame, slots 18 and 20 use DC-30, and slots 19 and 21 use HexVS.[1][2]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedTest and probe equipment is used in wafer-level test before devices move to later assembly or packaging steps.
The Ultra Flex BB 512 is positioned for electrical characterization at the probe stage rather than at final packaged-device test.
Applications
General reference — not yet source-verifiedTest and probe systems are used for semiconductor wafer probing and electrical evaluation of devices on the wafer.
What do the numbers mean?
Vacuum & pumping2
- Slot configuration
- Slot 0: GigaDig HD 2; Slot 4: HSS 6400; Slot 6: HSD-M; Slot 7: HSD-M; Slot 8: HSD-M; Slot 9: HSD-M; Slot 11: Turbo-Frame; Slot 14: HSD-M; Slot 15: HSD-M; Slot 16: HSD-M; Slot 17: HSD-M; Slot 18: DC-30; Slot 19: HexVS; Slot 20: DC-30; Slot 21: HexVS[1]
Configuration & options14
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Ultra Flex BB 512 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ultra Flex BB 512 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ultra Flex BB 512 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ultra Flex BB 512 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ultra Flex BB 512 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ultra Flex BB 512 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Ultra Flex BB 512 — Teradyne | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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