Waferpedia

Teradyne

ASM 3714

Test & ProbeTeradyne ASM family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Teradyne / Eagle ASM 3714 is a tool in the Test & Probe category. The ASM 3714 is compatible with the Teradyne Eagle ETS 364 Tester. The ASM 3714 includes CBITS.[1][2]

Teradyne logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

What it is

The Teradyne ASM 3714 is compatible with the Teradyne Eagle ETS 364 Tester. The ASM 3714 uses a CBITS interface.[1]

Where it fits in the process flow

General reference — not yet source-verified

In a semiconductor manufacturing flow, test and probe operations are inserted after wafer fabrication to sort known-good die (wafer sort) and again after packaging for final test. The ASM 3714 would be used in either or both of these steps, depending on the test strategy. Upstream steps include wafer fabrication and dicing (for wafer sort) or packaging (for final test); downstream steps include assembly or shipment.

Applications

General reference — not yet source-verified

The ASM 3714 is used for the electrical testing of semiconductor devices. Typical application areas include digital, analog, mixed-signal, and memory integrated circuits. The system supports parametric testing, functional testing, and burn-in screening when used with an appropriate tester.

What do the numbers mean?

Control & software1

Interface
CBITS[2]
Accurate?

Configuration & options4

Compatible with Teradyne Eagle ETS 364 Tester[1]
Accurate?
CBITS[1]
Accurate?
Category
Test & Probe[2]
Accurate?
Compatible tester
Teradyne Eagle ETS 364 Tester[2]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of semiconductor devices can be tested on a system like the Teradyne ASM 3714?General reference — not yet source-verified

Systems of this class are versatile and can test a broad range of devices, including digital, analog, mixed-signal, and some RF circuits, depending on the specific instrument configuration and test resources installed.

How does the system interface with a wafer prober?General reference — not yet source-verified

The test head of the system is mechanically and electrically docked to a wafer prober, which positions a probe card onto the surface of a wafer. The prober steps the wafer to align each die with the probe needles, while the test system applies signals and measures responses through the same interface.

What are common maintenance considerations for this class of equipment?General reference — not yet source-verified

Routine maintenance includes cleaning and inspecting probe cards or sockets, calibrating measurement channels and timing generators, checking cabling and connectors, and updating software. Preventative maintenance schedules are recommended to ensure measurement accuracy and system uptime.

Not publicly documented

The following facts about the ASM 3714 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ASM 3714 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the ASM 3714 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the ASM 3714 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the ASM 3714 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the ASM 3714 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 10, 2026.

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