Tegal
T 903 E Plasma RIE
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA reactive ion etcher removes material by combining plasma chemistry with ion bombardment at the wafer surface.
A tool of this class is used to transfer patterns into thin films by making the exposed regions react and etch more rapidly than protected regions.
Applications
General reference — not yet source-verifiedA reactive ion etcher is used for anisotropic etching of semiconductor films and patterned layers.
A plasma RIE is used for feature definition in device fabrication, including etching of dielectric films, conductive films, and other thin layers that require directional removal.
What do the numbers mean?
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the T 903 E Plasma RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the T 903 E Plasma RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the T 903 E Plasma RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the T 903 E Plasma RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the T 903 E Plasma RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the T 903 E Plasma RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 8, 2026.
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