Tegal
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The Tegal 903 E Dry is a dry etcher used in semiconductor manufacturing. The Tegal 903 E Dry processes 6-inch wafers.[1]
The system includes a wafer holder or chuck that may provide temperature control and helium backside cooling. Gas flow and chamber pressure are regulated to maintain a stable plasma, and endpoint detection systems can monitor the etch progress in real time.
After etching, the wafer moves to resist stripping and cleaning steps. The equipment is suited for front-end-of-line and back-end-of-line processing where precise material removal is required.
In addition to mainstream CMOS fabrication, such etch tools are used in MEMS, power device, and optoelectronic manufacturing where pattern transfer fidelity is critical.
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The following facts about the 903 E Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 903 E Dry are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 903 E Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 903 E Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 903 E Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 903 E Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 28, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.