701

Inline etchers are distinguished from batch etchers by their wafer-handling approach: wafers are loaded individually or in small groups and moved through the etch zone, often via a conveyor or track system, enabling higher throughput for certain process steps. The Tegal 701 belongs to this class of equipment, which offers advantages in process uniformity and repeatability for dedicated etch applications.

In an inline etcher, the wafer is transported through the chamber via a shuttle or belt mechanism, allowing for sequential processing. The etch process parameters such as gas flow, RF power, pressure, and temperature are controlled to achieve the desired etch rate, selectivity, and profile. Endpoint detection may be employed to monitor the etch depth and terminate the process accurately.

Downstream from the etch step, wafers proceed to cleaning and inspection, often followed by additional deposition or planarization processes. The Tegal 701's role is to transfer the pattern from the resist mask into the underlying film with controlled anisotropy and selectivity, a critical step in defining device features.

Typical materials etched on such equipment include silicon dioxide, silicon nitride, polysilicon, aluminum, and other metals, using fluorine- or chlorine-based chemistries. The tool may also be employed in research and development environments for process characterization and small-scale production.