Takatori
MWS-SiC6
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Takatori MWS-SiC6 is a multi wire saw from Takatori Corporation's MWS series. The MWS-SiC6 is used for slicing hard brittle materials including SiC, GaN, and sapphire.[1]
What it is
The Takatori MWS-SiC6 is a multi-wire saw (MWS) designed for slicing hard brittle materials.[1]
How it works
The MWS-SiC6 incorporates mechanisms that allow variable processing conditions, including the use of thin wire, high wire tension, fast wire running, and extended slicing times.[1]
Where it fits in the process flow
The MWS-SiC6 is capable of slicing a variety of hard brittle materials including silicon carbide, gallium nitride, lithium tantalate, lithium niobate, aluminum nitride, silicon nitride, gallium oxide, sapphire, crystal, gallium arsenide, gallium phosphide, indium phosphide, neodymium magnet, ceramics, resin, metal, platinum, silver, and gold.[1]
What can it run?
Process applications and technology nodes documented for this tool.
- Ga2O3
- Sapphire
- Crystal
- GaAs
- Neodymium magnet
- Ceramics
- Resin
- Metal
- Platinum
- Silver
- Gold
- any other hard brittle material
What do the numbers mean?
Configuration & options2
- Main materials capable of slicing
- SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold, and any other hard brittle material[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the MWS-SiC6?
The MWS-SiC6 is a multi-wire saw (MWS) used for slicing hard brittle materials.[1]
What materials can the MWS-SiC6 slice?
The MWS-SiC6 can slice SiC, GaN, LT, LN, ALN, SiN, Ga2O3, sapphire, crystal, GaAs, GaP, InP, neodymium magnet, ceramics, resin, metal, platinum, silver, and gold, among other hard brittle materials.[1]
What variable processing conditions does the MWS-SiC6 support?
The MWS-SiC6 supports variable conditions including thin wire, high wire tension, fast wire running, and extra-long time slicing processes.[1]
Not publicly documented
The following facts about the MWS-SiC6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the MWS-SiC6 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS-SiC6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MWS-SiC6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MWS-SiC6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MWS-SiC6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]takatori-g.co.jp — takatori-g.co.jptakatori-g.co.jp
Last updated Oct 9, 2026.
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