STS
Multiplex ASE ICP Deep Silicon
Wafer size
Manual wafer lock
Vacuum
Pumps are not included[1]
What it is
General reference — not yet source-verifiedThe STS Multiplex ASE ICP is an inductively coupled plasma etching system designed for deep silicon etching.
How it works
The STS Multiplex ASE ICP uses low and high frequency inductively coupled plasma. The ASE process operates by alternating between an etching cycle that removes silicon and a deposition cycle that deposits a protective polymer layer on sidewalls, repeating to produce anisotropic, high-aspect-ratio features.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe STS Multiplex ASE ICP is used after photolithography to transfer patterns into silicon substrates. Upstream process steps include photoresist coating, exposure, and development. Downstream steps include resist stripping, cleaning, and inspection.
The system is typically employed in the fabrication of microelectromechanical systems, through-silicon vias, and other devices requiring deep, high-aspect-ratio silicon features.
Applications
The STS Multiplex ASE ICP is used for deep silicon trench etching of a single six-inch substrate.[1]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Pumps are not included
What do the numbers mean?
Vacuum & pumping1
- Pumps are not included[1]
Wafer handling5
- The system can be used for deep Si trench etching of a single 6" [150mm] substrate[1]
Configuration & options7
- Low and high frequency ICP (Inductively Coupled Plasma) etch system.[1]
- The ASE (Advanced Silicon Etch) process consists of alternating cycles of etching and protective polymer deposition to achieve high aspect ratios.[1]
- Process description
- ASE (Advanced Silicon Etch) process consists of alternating cycles of etching and protective polymer deposition[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationPumps are not included[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Multiplex ASE ICP Deep Silicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Multiplex ASE ICP Deep Silicon are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Multiplex ASE ICP Deep Silicon is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 11, 2026.
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