Oxford Instruments
OPR Dry
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Oxford Instruments OPR Dry Etch is a dry etching system used in semiconductor manufacturing.[1]
How it works
General reference — not yet source-verifiedDry etchers introduce reactive gases into a vacuum chamber where a plasma is generated, usually by radio-frequency excitation.
The plasma breaks the gas molecules into reactive radicals and ions that chemically react with and physically bombard the material to be etched, creating volatile byproducts that are pumped away.
Where it fits in the process flow
General reference — not yet source-verifiedDry etching is a critical patterning step in semiconductor fabrication, used after photolithography to transfer the mask pattern into the underlying layers.
The dry etch process typically follows a photoresist development step and precedes resist stripping and subsequent deposition or cleaning steps.
Applications
General reference — not yet source-verifiedDry etching systems such as the Oxford OPR are employed to etch dielectric layers, silicon, and metals in the fabrication of integrated circuits and microelectromechanical systems.
The equipment is suitable for processes requiring anisotropic etch profiles, such as creating vertical sidewalls in trench or via formation.
What do the numbers mean?
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Where are the manuals?
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Not publicly documented
Field notes
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Not publicly documented
The following facts about the OPR Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the OPR Dry are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the OPR Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the OPR Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the OPR Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the OPR Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 29, 2026.
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