MPI

A flip chip prober uses a probe card whose contacts align with the solder bumps on the flipped die.
The prober positions each device under test and makes temporary electrical contact through the bumps, allowing parametric and functional tests to be performed by an external tester.
Flip chip probers are used in the final test step of flip chip package manufacturing, after the package has been assembled and before it is shipped to customers.
Flip chip probers are applied to test a wide range of flip chip devices, including microprocessors, graphics processors, memory chips, and application-specific integrated circuits.
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The following facts about the Capella FP 60 ML Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Capella FP 60 ML Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Capella FP 60 ML Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Capella FP 60 ML Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Capella FP 60 ML Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Capella FP 60 ML Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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