Micromanipulator
P 300 J Wafer
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
The P 300 J uses motorized controls with a joystick and MicroTouch interface to drive the stage, platen (Z), theta, and microscope X-Y and Z drives. The stage and platen have a positioning resolution of 0.1 microns. The stage travel range is 300 x 300 x 50 mm with 15 degrees of theta rotation. The microscope drive range is 100 x 100 mm (X-Y) and 200 mm (Z). The station features a single-point ground and an adjustable microscope lift delay to prevent probe damage. The system is also plumbed and wired to accept a thermal chuck with a temperature range of -55 to 300 °C.[1][2]
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling1
Optics & imaging1
Control & software2
Dimensions & facilities2
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Why test at the wafer level?General reference — not yet source-verified
Wafer-level testing allows devices and process structures to be evaluated early, which helps identify functional issues and monitor fabrication quality before later manufacturing steps.
What kinds of devices are measured with this class of equipment?General reference — not yet source-verified
Such systems are used for semiconductor devices and test structures that expose contact pads or probing sites on the wafer surface.
Not publicly documented
The following facts about the P 300 J Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 300 J Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 300 J Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 300 J Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 300 J Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P 300 J Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]micromanipulator.com — micromanipulator.commicromanipulator.com
- [2]mercia-semiconductor.com — mercia-semiconductor.commercia-semiconductor.com
- [3]Equipment inventory listing
Last updated Oct 6, 2026.
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