Meyer Burger
DS 266
What it is
How it works
General reference — not yet source-verifiedA wafer saw separates semiconductor wafers by moving a cutting element through the workpiece in a controlled mechanical operation.
A dicing and grinding platform typically performs singulation, edge reduction, or material removal on wafer-scale parts before later handling or packaging steps.
Where it fits in the process flow
General reference — not yet source-verifiedThe Meyer Burger DS 266 fits in back-end wafer processing where wafers are cut or thinned before later assembly steps.
A machine in this class usually follows wafer fabrication steps and precedes die handling, assembly, or packaging operations.
Applications
What do the numbers mean?
Power & electrical3
Wafer handling1
Control & software2
- Complete with HDD & Software[2]
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Disco DFG 8560— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of machine is the Meyer Burger DS 266?
The Meyer Burger DS 266 is a wire saw.[1]
Not publicly documented
The following facts about the DS 266 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DS 266 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DS 266 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DS 266 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DS 266 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DS 266 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
Last updated Oct 10, 2026.
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General referenceThe Disco DFG 8560 is a dicing and grinding system for semiconductor wafer processing, used in backend assembly for singulation and thinning.
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