Logitech
CS30
The Logitech CS30 Compact Trim Saw is a robust saw for thin section preparation. The Logitech CS30 Compact Trim Saw is fitted with a 200mm diameter diamond blade. The Logitech CS30 Compact Trim Saw uses a ceramic vacuum chuck to hold two slides while the blade cuts through the material.[1]
What it is
The Logitech CS30 is a compact trim saw designed for thin section preparation in geological and materials science applications.[1]
The CS30 uses a 200 mm diameter diamond blade and a ceramic vacuum chuck to hold slides during cutting.[1][2]
The machine is intended for trimming slide-mounted specimens such as rock, concrete, fossils, and bone.[1][3]
How it works
Where it fits in the process flow
The CS30 thins the specimen to a target thickness, readying it for second-face lapping in the thin section preparation workflow.[1]
Applications
The CS30 is suitable for preparing thin sections of geological materials such as rock, concrete, fossils, and bone.[1][3]
The machine can also be used for trimming a wide variety of other materials, including those used in semiconductor and optoelectronics applications.[1]
- thin section preparation
- thinning slide-mounted specimens down to 500 µm
- trimming rock
- trimming concrete
- trimming fossils
- trimming bone
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Dimensions & facilities3
Configuration & options12
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the basic function of a dicing and grinding machine?General reference — not yet source-verified
A dicing and grinding machine is used to cut substrates, such as semiconductor wafers, into individual dies and to thin them to a precise thickness for further processing or packaging.
Where is this class of equipment positioned in the manufacturing process?General reference — not yet source-verified
Dicing and grinding machines are typically used in the backend of semiconductor fabrication or in the finishing stages of optics production, after the device structures are formed but before final packaging or assembly.
What are the primary considerations for using a dicing and grinding machine in production?General reference — not yet source-verified
Key considerations include maintaining consistent cutting and grinding precision, minimizing chipping and cracking of brittle materials, and managing mechanical stability and coolant flow for reliable operation and long blade life.
Not publicly documented
The following facts about the CS30 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CS30 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CS30 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CS30 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CS30 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CS30 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]CS30 — Logitech | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]CS30 | Altmann — altmann.com.braltmann.com.br
Last updated Oct 5, 2026.
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