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Laurell

SU-8

LithographyLaurell SU-8 family
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The Laurell SU-8 is a spin station used for coating substrates with SU-8 photoresist, an epoxy-based negative photoresist designed for micromachining and microelectronic applications requiring thick, chemically and thermally stable images. The SU-8 photoresist is a negative photoresist where parts exposed to UV become cross-linked, while the remainder remains soluble and can be washed away during development. SU-8 derives its name from the presence of 8 epoxy groups on average per moiety.[1][2]

LaurellSU-8
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Gas delivery

SU-8 (negative epoxy photoresist)[1]

Optics

i-line (365 nm)[1]

How it works

SU-8 is a negative epoxy photoresist. The resist is exposed after coating, and the exposed portions crosslink during thermal processing before development removes the unexposed material.[2][1]

Where it fits in the process flow

The Laurell SU-8 fits in the lithography sequence after substrate preparation and coating and before exposure, post-exposure bake, and development. The SU-8 process flow includes spin coat, soft bake, expose, post-exposure bake, and develop.[2]

The FabLab lithography area also includes mask aligners, a maskless aligner, photoresist spin stations, a developing bench, and a photo oven. The Laurell SU-8 spin station belongs to that lithography group of tools.[3]

Applications

SU-8 is used for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired. The material is suited to high aspect ratio patterning and near vertical sidewalls.[2][1]

SU-8 is used in microfluidics, MEMS, bio-MEMS, and other microfabrication work. The resist can be processed with standard contact lithography at certain thicknesses and is commonly exposed with i-line ultraviolet light.[1][2]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Above 500 μm thickness, absorption leads to increasing sidewall undercuts and poor curing at the substrate interface
  • SU-8 is very difficult to remove after full crosslinking
  • Cracking and stress can occur due to thermal effects; controlled baking steps are required

What do the numbers mean?

Wafer handling1

Substrate Size (example used in research)
150 mm (6-inch) silicon wafer[6]
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Gas & chemistry3

Photoresist Type
SU-8 (negative epoxy photoresist)[1]
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Aspect Ratio (achieved)
>20 with solution formulation; >40 with dry resist[1]
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Developer
1-methoxy-2-propanol acetate (PGMEA) or SU-8 Developer[1]
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Optics & imaging4

Exposure Wavelength
i-line (365 nm)[1]
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Maximum Absorption
Ultraviolet light at 365 nm[1]
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Post Exposure Bake Temperature (first step)
65 °C[2]
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Post Exposure Bake Temperature (second step)
95 °C[2]
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Configuration & options10

Equipment name
Spin Station- Laurell- SU-8 ONLY[3]
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Category
Lithography[3]
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Type
Spin station[3]
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Film Thickness Range (single spin coat)
1 to >200 μm[2]
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Maximum Film Thickness (multiple coats or dry film)
Up to above 300 μm (spun) or above 1 mm (dry film)[1]
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Operational Mode
Dedicated to SU-8 only[3]
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Spin Speed (recommended for reproducibility)
3000 rpm[4]
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Soft Bake Temperature (typical first step)
65 °C[2]
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Soft Bake Temperature (typical second step)
95 °C[2]
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Hard Bake Temperature (optional)
150 °C[5]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Photoresist TypeSU-8 (negative epoxy photoresist)[1]
  • Aspect Ratio (achieved)>20 with solution formulation; >40 with dry resist[1]
  • Developer1-methoxy-2-propanol acetate (PGMEA) or SU-8 Developer[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What does the Laurell SU-8 tool do?

The Laurell SU-8 tool is a spin station for SU-8 lithography coating.[3]

What process sequence is used for SU-8?

The SU-8 process sequence is spin coat, soft bake, expose, post-exposure bake, and develop.[2]

What kind of exposure is SU-8 optimized for?

SU-8 is optimized for i-line and broadband exposure, and i-line exposure tools are recommended.[2]

What are common SU-8 application areas?

Common SU-8 application areas include micromachining, microfluidics, MEMS, and bio-MEMS.[2][1]

Not publicly documented

The following facts about the SU-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SU-8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SU-8 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the SU-8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the SU-8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the SU-8 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.org — en.wikipedia.orgen.wikipedia.org
  2. [2]wp.optics.arizona.edu — wp.optics.arizona.eduwp.optics.arizona.edu
  3. [3]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
  4. [4]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
  5. [5]repository.upenn.edurepository.upenn.edu
  6. [6]iopscience.iop.orgiopscience.iop.org
  7. [7]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
  8. [8]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
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Last updated Sep 30, 2026.

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