Momenturm 776

Chemical mechanical planarization tools polish and planarize the surface of a semiconductor wafer by combining chemical etching with mechanical abrasion. The process removes excess material deposited during earlier fabrication steps and prepares the wafer for subsequent lithography and patterning. CMP tools are a standard part of modern semiconductor manufacturing and are used to achieve the global flatness required for multi-layer device stacks.

A CMP tool holds a wafer face-down against a rotating platen covered with a polishing pad. An abrasive slurry containing chemical reagents is dispensed onto the pad. The combined chemical action of the slurry and the mechanical force from the pad removes material from the wafer surface. The tool applies controlled downforce and rotational speed to achieve a uniform removal rate across the wafer.

CMP is used at multiple points in the semiconductor fabrication process, most commonly after dielectric deposition, metal deposition, or shallow trench isolation. The tool planarizes the wafer surface before subsequent photolithography steps, where depth of focus requirements demand extreme flatness. Downstream processes include cleaning, inspection, and further deposition or patterning.