Lam Research
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The Lam Research 490 is an automatic plasma etcher. The Lam Research 490 is a cassette-to-cassette system. The Lam Research 490 is configurable for 3-inch to 6-inch wafers.[1][2]
The Lam Research 490 is an etch tool.[1][4]
The Lam Research 490 is an automatic cassette-to-cassette plasma etching platform.[1][2]
The Lam Research 490 supports semiconductor wafer processing applications that require stable plasma control, automated wafer handling, and repeatable process capability.[1]
The Lam Research 490 supports oxide etching, dielectric etching, thin film etching, descum processing, and related semiconductor plasma applications.[1]
The Lam Research 490 is used for semiconductor process development, university work, research institute work, MEMS processing, and compound semiconductor processing.[1]
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The Lam 490 is configurable for wafers from 3 inches to 6 inches; typical configurations handle 4-inch to 6-inch wafers.[1][2]
Yes, it is a cassette-to-cassette automatic plasma etcher with fully automated microprocessor control.[1][2]
Yes, endpoint detection is included.[2]
The following facts about the 490 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 490 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 490 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 490 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 490 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 490 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 30, 2026.
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