Waferpedia

Hanwha

SP 1 C

Assembly / SMTHanwha SP 1 C family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

HanwhaSP 1 C
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What it is

The Hanwha SP 1 C is a screen printer used in surface-mount technology (SMT) assembly.[2][1]

The SP 1 C is a model of screen printer manufactured by Hanwha.[2][1]

How it works

General reference — not yet source-verified

Screen printers deposit solder paste onto a PCB by forcing the paste through the apertures of a stencil using a squeegee.

After paste application, the PCB is aligned with a stencil, paste is applied, and the stencil is then separated from the board.

Where it fits in the process flow

The SP 1 C is used in the assembly stage of electronics manufacturing.[2][1]

Applications

The SP 1 C is used for applying solder paste in SMT assembly processes.[2][1]

What do the numbers mean?

Configuration & options2

Category
Assembly / SMT[1]
Accurate?
Vintage
2016[2]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the SP 1 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the SP 1 C are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SP 1 C are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SP 1 C are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the SP 1 C are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the SP 1 C are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
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Last updated Oct 2, 2026.

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