EV Group
810LT
The EV Group 810LT is a low temperature plasma activation system. The EV Group 810LT is used to prepare wafer surfaces before bonding experiments. The EV Group 810LT supports low-power, short-duration nitrogen, oxygen, and argon plasma treatments.[1][2]
Plate 01EVG 810LT Plasma Cleaner Demo
Lithography Equipment SupportWatch on YouTube
What it is
The EV Group 810LT is a low temperature plasma activation system used to prepare wafer surfaces before bonding experiments.[1]
The EV Group 810LT supports low temperature plasma activation with nitrogen, oxygen, or argon process gases. The EV Group 810LT is operated with manual wafer loading and unloading and automated chamber closing and opening.[2][3]
How it works
A plasma activation system exposes the wafer surface to a controlled plasma so the surface can be modified before bonding. The EV Group 810LT offers low power, short-duration plasma treatments using nitrogen, oxygen, or argon.[1]
The EV Group 810LT uses a chamber with a wafer chuck and cover mechanism. The operator loads the wafer into the chamber, closes the cover, starts a recipe in the control software, and monitors the plasma during the process.[1]
Where it fits in the process flow
The EV Group 810LT sits before wafer bonding in the process flow. The EV Group 810LT prepares wafer surfaces for bonding experiments.[1]
Applications
The EV Group 810LT is used for surface activation of wafers before bonding. The EV Group 810LT provides standard plasma treatment programs with nitrogen, oxygen, and argon.[1]
What do the numbers mean?
Wafer handling2
Gas & chemistry1
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- process gasesO2, N2, or Ar[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the 810LT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 810LT are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 810LT are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 810LT are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 810LT are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 810LT is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Last updated Oct 3, 2026.