Electroglas
Wafer probers operate by loading a wafer onto a temperature-controlled chuck, which can be heated for test at elevated temperatures. The chuck moves the wafer in X, Y, and theta axes to align each die under a fixed probe card that contains an array of fine needles.
The prober makes electrical contact between the probe needles and the die's bond pads, enabling an external tester to apply signals and measure responses. The machine steps the wafer from die to die automatically until the entire wafer is tested.
Wafer probing is performed after wafer fabrication and before final assembly and packaging. At the probe step, known-good die are identified and defective die are marked or mapped, so that only functional die proceed to packaging.
The EG 4080 sits in the electrical test area of a semiconductor fab, downstream of all front-end processing (deposition, lithography, etch) and upstream of dicing, die attach, and packaging.
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The EG 4080 can be equipped with an IOSS 120 wafer reader that supports barcode and OCR reading.[1]
The following facts about the EG 4080 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 4080 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EG 4080 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EG 4080 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 4080 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG 4080 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.