Electroglas
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A wafer prober is a semiconductor test system that positions a wafer under a probe card to electrically test individual die before they are singulated. The prober steps the wafer to align each die with the probe needles, enabling parametric or functional testing via an external tester.
Wafer probers use a precision positioning stage to move the wafer in X, Y, and Z axes. A camera system aligns the wafer to the probe card, and the stage lifts the wafer so that each die’s bond pads contact the probe needles. A tester connected to the probe card then performs electrical measurements, and the prober steps to the next die. Many probers include automation features such as cassette handling, pre‑alignment, and inking of failed die.
Electroglas product history mentions the 2001X automatic wafer prober.
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The following facts about the 2001 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 2001 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2001 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2001 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2001 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2001 X are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 9, 2026.