Electroglas
2001 CX
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wafer prober moves a wafer stage in the X and Y axes to bring each die sequentially under a stationary probe card. The probe card's pins contact the die's bond pads, allowing a connected test system to perform parametric or functional electrical measurements.
Applications
General reference — not yet source-verifiedApplications for wafer probers include functional testing of integrated circuits, parametric testing for process control, quality and reliability assessments, and research and development activities.
What do the numbers mean?
Wafer handling1
Configuration & options5
- Single channel[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Accretech UF 3000 EX— Same function class: Test & Probe, nullCompare in depthsource[3]
- Accretech UF 300— Same function class: Test & Probe, nullCompare in depthsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the primary function of a wafer prober?General reference — not yet source-verified
The primary function is to precisely align and make temporary electrical contact between test equipment and individual semiconductor die on a wafer, allowing each die to be tested before the wafer is diced.
What types of probe cards are commonly used?General reference — not yet source-verified
Common types include cantilever needles, vertical probes, and membrane probes, chosen based on pad pitch, frequency requirements, and number of contact points.
What maintenance is typical for a wafer prober?General reference — not yet source-verified
Routine maintenance includes cleaning the chuck and probe card contacts, verifying alignment accuracy, inspecting probe needles for wear or contamination, and calibrating temperature systems if used.
What role does a wafer prober play in semiconductor manufacturing yield improvement?General reference — not yet source-verified
By testing dice at the wafer level, the prober helps identify defective devices early, allowing process engineers to diagnose yield issues and improve manufacturing processes before further value is added.
Not publicly documented
The following facts about the 2001 CX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2001 CX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2001 CX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2001 CX are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2001 CX are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2001 CX is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]ELECTROGLAS INC Form 10-K405 (1997) — SEC EDGAR — sec.gov (Mar 26, 1997)sec.gov
Last updated Sep 28, 2026.
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