Disco
DGP 8761 + DFM 2800 In-Line
The Disco DGP 8761 + DFM 2800 In-Line Grinder is a fully automatic grinder. The Disco DGP 8761 + DFM 2800 In-Line Grinder has 3-axis operation. The Disco DGP 8761 + DFM 2800 In-Line Grinder is configured for 200 mm and 300 mm wafers.[1]
What it is
The Disco DGP 8761 + DFM 2800 In-Line is a semiconductor dicing and grinding system. The machine is a fully automatic in-line grinder with a 3-axis configuration.[1]
The Disco DGP 8761 + DFM 2800 In-Line is configured for 200 mm and 300 mm wafers. The machine includes robot pick inline handling for dedicated 200 mm and 300 mm wafers, a chuck table, a spinner table, and a foup opener unit.[1]
How it works
The Disco DGP 8761 + DFM 2800 In-Line uses automatic wheel position setup, vacuum maintenance using a vacuum ejector, and a Z3-axis processing point temperature sensor. The machine also includes a sub-air switching unit, a water temperature control unit, and primary piping joints for dry polish and other connected functions.[1]
Where it fits in the process flow
The Disco DGP 8761 + DFM 2800 In-Line supports host communication through SECS-1, SECS-2, and GEM. The machine also includes uninterruptible power supply external type hardware, EMO guard rings, transport jig hardware, and machine hoisting jig plus export packing hardware.[1]
Applications
The Disco DGP 8761 + DFM 2800 In-Line is configured with a dry polish specification and a DBG specification with a high-power atomizing nozzle. The machine is also equipped with NCG plus Auto TTV.[1]
What do the numbers mean?
Vacuum & pumping1
- Vacuum Maintenance Using Vacuum Ejector[1]
Wafer handling6
Control & software2
Configuration & options23
- Fully Automatic[1]
- 3 Axis[1]
- Spinner Table 200 mm/300 mm Universal (Orientation Flat)[1]
- Transport jig Machine hoisting jig+ Export packing hardware[1]
- USB Memory[1]
- Primary Piping Joint for DGP8761 (Dry Polish Specification)[1]
- Primary Piping Joint for Sub-Air Switching Unit[1]
- Automatic Wheel Position Setup[1]
- Sub-Air Switching Unit[1]
- Z3-axis processing point temperature sensor (without adjustment jig)[1]
- Host communication SECS-1/-2 and GEM compliant[1]
- EMO Guard Ring for DGP8761[1]
- EMO guard ring for DTU1531[1]
- Power Cable for the DGP8761 7M[1]
- Post retrofit configuration[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationVacuum Maintenance Using Vacuum Ejector[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the machine support?
The machine supports 200 mm and 300 mm wafers.[1]
Is the machine fully automatic?
The machine is fully automatic.[1]
What host communication standards are included?
The machine is SECS-1, SECS-2, and GEM compliant.[1]
What handling hardware is included?
The configuration includes a robot pick inline dedicated unit, a foup opener unit, a transport jig, and machine hoisting jig plus export packing hardware.[1]
Not publicly documented
The following facts about the DGP 8761 + DFM 2800 In-Line are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 + DFM 2800 In-Line are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8761 + DFM 2800 In-Line are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8761 + DFM 2800 In-Line are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 + DFM 2800 In-Line are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8761 + DFM 2800 In-Line is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 7, 2026.
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