Disco
DGP 8760
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedThe Disco DGP 8760 is a chemical mechanical planarization (CMP) polisher used in semiconductor manufacturing. CMP polishers remove material from wafer surfaces to achieve global planarization, combining chemical etching with mechanical abrasion.
How it works
General reference — not yet source-verifiedIn a typical CMP polisher, a wafer is mounted on a rotating carrier head and pressed against a rotating polishing pad on a platen. A chemically reactive slurry is dispensed onto the pad, where the combined chemical dissolution and mechanical abrasion remove material evenly across the wafer surface. The Disco DGP 8760 operates on this principle as a CMP tool.
Where it fits in the process flow
General reference — not yet source-verifiedCMP polishers are used after deposition steps such as dielectric or metal layer formation, to planarize the wafer surface before subsequent lithography or metallization. The Disco DGP 8760 fits in the fabrication sequence following deposition and before patterning steps.
Applications
General reference — not yet source-verifiedCMP polishers like the Disco DGP 8760 are applied to planarize interlayer dielectrics, shallow trench isolation, and metal layers such as copper in damascene processes. The tool is used in front-end-of-line and back-end-of-line planarization steps.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DGP 8760 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the DGP 8760 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8760 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8760 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8760 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8760 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
- [3]DGP 8760 — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 24, 2026.
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