Disco
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The Disco DFG 840 is a fully automatic in-feed surface grinder used for semiconductor wafer thinning. The machine is designed for backgrinding applications in the semiconductor manufacturing process.[2]
The DFG 840 features a two-spindle, three-rotary-chuck table configuration that supports high-quality ultra-thin grinding. The machine also includes a robot arm for wafer handling and a same-cassette return function.[2]
The DFG 840 handles wafers from 4 to 8 inches in diameter. The system is powered by three-phase electrical supply at 200 V AC, 50/60 Hz, and includes a Pure Boyd PBH 100 Oil Mist Filtration System.[2][1]
The DFG 840 operates using in-feed grinding with wafer rotation. Two independently adjustable spindles are used, each capable of spindle speeds from 1000 to 7000 RPM with a vertical stroke of 110 mm.[2]
The machine employs a porous chuck table with a vacuum chuck to hold the wafer during grinding. An 8-inch diamond grinding wheel is used for material removal. The robot arm employs vacuum to handle thin, warped wafers while maintaining flatness for trouble-free processing.[2]
The DFG 840 is used in the backend of semiconductor manufacturing for wafer thinning, typically after front-end fabrication and before dicing or packaging. The machine is suitable for ultra-thin grinding applications required for 3D integration and bonded wafers.[2]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DFG 840/841 | — | — | A source groups the DFG 840 with the DFG 841 and describes the pair as backgrinding systems. | s3-alliance.com[2] |
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The DFG 840 handles wafers from 4 to 8 inches in diameter.[2]
The spindle speed range is 1000 to 7000 RPM.[2]
The DFG 840 uses a porous chuck table with a vacuum chuck.[2]
The planarity accuracy within a wafer is 0.0015 mm.[2]
The DFG 840 Automatic requires three-phase power, 50/60 Hz, AC 200 V.[1]
Yes, the DFG 841 complies with the EC’s CE marking.[2]
The following facts about the DFG 840 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 840 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DFG 840 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 840 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 840 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFG 840 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 8, 2026.