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Disco

DFD 6361 Fully Automatic Dicing

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DiscoDFD 6361 Fully Automatic Dicing
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Power

1.2 kW at 60,000 min⁻¹[1]

Vacuum

0.5 to 0.8 MPa[1]

Performance

0.003 mm/310 (single error), ≤0.002 mm/5[1]

Optics

0.00005 mm[1]

What it is

The Disco DFD 6361 is a fully automatic dicing saw designed for precision cutting of semiconductor wafers.[2][3][1][4]

The DFD 6361 is a dicing saw that handles wafer sizes up to 300 mm in diameter.[3][1][4]

The machine weighs approximately 2,050 kg without a transformer for overseas use and approximately 2,150 kg with such a transformer.[1][4]

How it works

The DFD 6361 uses a facing dual-spindle design with two spindles to enhance throughput.[3][1][4]

The machine reduces the distance between the blades to manage total cut time.[3][1][4]

High-magnification microscopes are standard on both Z axes, and non-contact setup sensors are an option, to reduce non-dicing sequence time.[3][1][4]

The DFD 6361 employs a Synchro Spindle with superior radial rigidity for consistent cut quality.[3][1][4]

An optional atomizing nozzle cleaning mechanism can be installed in the spinner unit to clean wafers after dicing.[3][1][4]

A cutting water flow rate control feature allows the flow rate to be managed on the screen.[3]

The DFD 6361 has an adjustable LCD touch screen with a graphical user interface.[3][4]

The machine uses a bridge-type frame structure and an improved wafer handling system for a compact footprint.[3][1][4]

A standard spindle option has a power rating of 1.2 kW and a rotation speed range of 6,000 to 60,000 min-1.[3][1][4]

Optional 1.8 kW and 2.2 kW spindles with a center thrust design are available for processing high-load materials such as glass and ceramics.[3][1][4]

A condition monitor relays processing status and key equipment information in real time.[3][1][4]

The X-axis cutting range is 310 mm, and the Y1 and Y2 axes each have a cutting range of 310 mm.[3][1][4]

The Z-axis maximum stroke is 14.7 mm for a 2-inch blade or 14.9 mm for a 3-inch blade.[3][1][4]

Where it fits in the process flow

The workpiece flow begins with a frame pick arm moving the workpiece from a cassette to a pre-alignment stage.[3][1][4]

After centering, a lower arm moves the workpiece to a chuck table for cutting.[3][1][4]

Following cutting, an upper arm moves the workpiece to a spinner table for cleaning and drying.[3][1][4]

A lower arm then returns the workpiece to the pre-alignment stage, and the frame pick arm returns it to the cassette.[3][1][4]

Applications

The machine supports a DBG (Dicing Before Grinding) process.[3]

With optional high-power spindles, the DFD 6361 can process glass, ceramics, and other high-load materials.[3][4]

What do the numbers mean?

Power & electrical4

Spindle output (standard)
1.2 kW at 60,000 min⁻¹[1]
Accurate?
Power supply
200-240 V AC ±10%, 3-phase, 50/60 Hz[1]
Accurate?
Power consumption (processing)
2.2 kW (reference)[1]
Accurate?
Power consumption (warm-up)
1.8 kW (reference)[1]
Accurate?

Vacuum & pumping5

Air pressure
0.5 to 0.8 MPa[1]
Accurate?
Clean air pressure
0.5 to 0.8 MPa[1]
Accurate?
Cutting water pressure
0.2 to 0.4 MPa[1]
Accurate?
Cooling water pressure
0.2 to 0.4 MPa[1]
Accurate?
Exhaust duct capacity
5.0 m³/min[1]
Accurate?

Optics & imaging1

Z-axis moving resolution
0.00005 mm[1]
Accurate?

Performance2

Y2-axis positioning accuracy
0.003 mm/310 (single error), ≤0.002 mm/5[1]
Accurate?
Z2-axis repeating accuracy
0.001 mm[1]
Accurate?

Dimensions & facilities3

Cooling water flow rate
3.0 L/min at 0.3 MPa[1]
Accurate?
Machine dimensions (W×D×H)
1200×1550×1800 mm[1]
Accurate?
Machine weight
Approx. 2,050 kg (without transformer), approx. 2,150 kg (with transformer)[1]
Accurate?

Configuration & options14

Max workpiece size
300 mm[1]
Accurate?
X-axis cutting range
310 mm[1]
Accurate?
Cut speed
0.1 to 600 mm/s[1]
Accurate?
Y1-axis cutting range
310 mm[1]
Accurate?
Index step
0.0001 mm[1]
Accurate?
Z1-axis max stroke
14.7 mm (for 2-inch blade)[1]
Accurate?
Maximum blade size
58 mm diameter[1]
Accurate?
θ-axis max rotating angle
380 degrees[1]
Accurate?
Spindle speed range
6,000 to 60,000 min⁻¹[1]
Accurate?
Average air consumption
189.0 L/min (ANR, reference)[1]
Accurate?
Average clean air consumption
65.0 L/min (ANR, reference)[1]
Accurate?
Cutting water max flow rate
12 L/min[1]
Accurate?
Water curtain max flow rate
1 L/min[1]
Accurate?
Other water max flow rate
1 L/min[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle output (standard)1.2 kW at 60,000 min⁻¹[1]
  • Power supply200-240 V AC ±10%, 3-phase, 50/60 Hz[1]
  • Power consumption (processing)2.2 kW (reference)[1]
  • Power consumption (warm-up)1.8 kW (reference)[1]
  • Air pressure0.5 to 0.8 MPa[1]
  • Clean air pressure0.5 to 0.8 MPa[1]
  • Cutting water pressure0.2 to 0.4 MPa[1]
  • Cooling water pressure0.2 to 0.4 MPa[1]
  • Exhaust duct capacity5.0 m³/min[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What spindle options are available for the DFD 6361?

The standard spindle is a 1.2 kW unit. Optional spindles include a 1.8 kW spindle (for 2-inch blades) and a 2.2 kW spindle (for 3-inch blades), both with a center thrust design for extra rigidity.[3][1][4]

What are the dimensions and weight of the DFD 6361?

The machine dimensions are 1,200 mm (width) by 1,550 mm (depth) by 1,800 mm (height). The weight is approximately 2,050 kg without a transformer.[3][1][4]

How is throughput enhanced on the DFD 6361?

Throughput is enhanced in two ways: the facing dual-spindle design and reduced distance between blades cut total processing time, and standard high-magnification microscopes plus optional non-contact setup sensors for both Z1 and Z2 reduce non-dicing sequence time.[3][1][4]

What cleaning options are available for the DFD 6361?

An atomizing nozzle cleaning mechanism can be installed in the spinner unit as an option to effectively clean wafers after dicing. The cutting water flow rate is programmable via the touch-panel display.[3][1][4]

What is the X-axis cutting speed range of the DFD 6361?

The X-axis cutting speed range is 0.1 to 600 mm/s.[3][1][4]

Not publicly documented

The following facts about the DFD 6361 Fully Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6361 Fully Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DFD 6361 Fully Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DFD 6361 Fully Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFD 6361 Fully Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFD 6361 Fully Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]fabsurplus.com — fabsurplus.comfabsurplus.com
  2. [2]Equipment inventory listing
  3. [3]DFD6361 | Dicing Saws | Product Information | DISCO CORPORATION — disco.com.sgdisco.com.sg
  4. [4]http://tstvn.com/wp-content/uploads/2021/07/dfd6361.pdf — tstvn.comtstvn.com
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Last updated Sep 26, 2026.

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