Disco
The Disco DFD 6361 is an automatic dicing saw. The Disco DFD 6361 uses three-phase electrical power at 50/60 Hz. The Disco DFD 6361 is specified with 200-240 VAC, 18 A full load current, 20 A main breaker rating, and 8 A ampere rating of largest load.[1]

An automatic dicing saw operates by mounting a wafer on a dicing tape stretched over a frame (ring). The saw uses a spindle to rotate a thin diamond-impregnated blade at high speed. A programmable stage moves the wafer under the blade in precise X–Y patterns to follow the scribe lines. During cutting, a stream of deionized water cools the blade and flushes away debris. The machine automatically indexes to the next cut after each pass.
Dicing saws are used in the back-end semiconductor packaging process. The dicing step follows wafer thinning (backgrinding) and precedes die attach, wire bonding, and encapsulation. In some flows, dicing may be performed after wafer-level packaging processes.
The primary application of a dicing saw is singulation of semiconductor wafers into individual die. Dicing saws can cut a variety of substrate materials, including silicon, gallium arsenide, glass, ceramics, and some polymer-based substrates. The machines are also used in the production of MEMS devices, LED chips, and other microscale components that require precise separation.
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The following facts about the DFD 6361 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6361 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6361 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6361 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6361 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6361 Automatic Dicing is not on record.
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Last updated Sep 26, 2026.
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