Disco
DFD 6341 Fully Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
The DFD 6341 uses dual spindles and automated wafer handling to move a workpiece from cassette to pre-alignment, then to the chuck table for cutting, then to a spinner table for cleaning and drying before return to the cassette.[1]
The DFD 6341 includes a graphical user interface and an LCD touch panel for operator control.[1]
Where it fits in the process flow
The DFD 6341 performs cutting, cleaning, and drying as part of the same automated flow.[1]
Applications
The DFD 6341 is used for semiconductor wafer dicing and die separation.[2][1]
The DFD 6341 is used for high-volume wafer cutting operations and precision dicing of semiconductor substrates.[2]
What do the numbers mean?
Power & electrical2
Optics & imaging1
Performance3
Dimensions & facilities2
Configuration & options7
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the DFD 6341 process?
The DFD 6341 is designed for eight-inch wafers.[1]
What automated handling sequence does the DFD 6341 perform?
The DFD 6341 moves the workpiece from cassette to pre-alignment, then to the chuck table for cutting, then to the spinner table for cleaning and drying, and then returns the workpiece to the cassette.[1]
Does the DFD 6341 include a user interface for operation?
The DFD 6341 includes a graphical user interface and an LCD touch panel.[1]
Not publicly documented
The following facts about the DFD 6341 Fully Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6341 Fully Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6341 Fully Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6341 Fully Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6341 Fully Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6341 Fully Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]disco.com.sg — disco.com.sgdisco.com.sg
- [2]DFD6341 PDF Manual - Fully Automatic Dicing Saw — datasheetgo.comdatasheetgo.com
- [3]Equipment inventory listing
Last updated Sep 26, 2026.
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