Disco
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The Disco DAD 552 is an automatic dicing saw.[1]
The wafer is held by vacuum on a porous chuck table, and the blade assembly moves along the X-axis while the table indexes in the Y-axis to follow the dicing streets.
A camera-based alignment system optically locates fiducials or street patterns to ensure accurate cuts, and the saw then executes a programmed cutting sequence.
Dicing is typically performed on a wafer that has been mounted on a dicing tape stretched across a frame, providing support for the individual die after cutting is complete.
After dicing, the separated die are ready for pick-and-place operations that transfer them to packages or substrates.
Beyond standard die separation, the machine can be applied to singulation of MEMS devices, LEDs, and passive components.
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The following facts about the DAD 552 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 552 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 552 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 552 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 552 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 552 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 26, 2026.
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