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Disco

DAD 3221 Automatic Dicing

Dicing & GrindingDisco DAD family
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The Disco DAD 3221 Automatic Dicing Saw is a single-spindle dicing saw. The Disco DAD 3221 Automatic Dicing Saw is capable of handling and dicing work pieces up to 6-inch wafers. The Disco DAD 3221 Automatic Dicing Saw has machine dimensions of 490 mm × 870 mm × 1,670 mm.[1][2]

DAD 3221 Automatic Dicing — Inventory photo
Fig. 01DAD 3221 Automatic DicingInventory photo[1]

Power

380–420 V, 3 phases, 50 Hz[1]

Performance

0.005 mm / 160 mm (single error)[2]

Optics

0.000002 mm[2]

What it is

The Disco DAD 3221 is an automatic dicing saw used for separating semiconductor wafers into individual chips.[1][2]

The machine is a single-spindle model equipped with a 2.0 kW synchro spindle capable of rotation speeds from 3,000 to 40,000 rpm.[1][2]

How it works

The machine incorporates an automatic kerf check function to monitor cut quality and an auto-focus system for the alignment microscope.[1]

Condition monitoring parameters such as spindle rotation speed, spindle current, vacuum level, and air pressure are displayed on a 15-inch LCD touch-panel monitor with a graphical user interface.[1]

Where it fits in the process flow

General reference — not yet source-verified

The dicing saw is used after wafer thinning and mounting on dicing tape, cutting the wafer in one or two passes to separate individual die.

Downstream steps include die picking, cleaning, and packaging; the cut quality directly affects die strength and yield.

Applications

General reference — not yet source-verified

The machine is primarily used for dicing silicon wafers into integrated circuits and other semiconductor devices.

What do the numbers mean?

Power & electrical5

Internal transformer, 380-420V, 3 phases, 50 Hz[1]
Accurate?
Internal transformer / power
380–420 V, 3 phases, 50 Hz[1]
Accurate?
Spindle power
2.0 kW (standard), 1.8 kW (option)[2]
Accurate?
Power supply
380-420 V, 3 phases, 50 Hz (internal transformer)[1]
Accurate?
Rated torque (2.0 kW spindle)
0.48 N·m[2]
Accurate?

Vacuum & pumping2

Condition monitoring function (spindle rpm, spindle current, vacuum, air pressure, etc. are displayed on the touch panel monitor)[1]
Accurate?
Automatic lens shutter with air pressure blow[1]
Accurate?

Wafer handling5

6” porous chuck table for 6” frames[1]
Accurate?
Capable of handling and dicing work pieces up to 6” wafers[1]
Accurate?
Wafer size
6 inch[1]
Accurate?
Chuck table
6-inch porous chuck table for 6-inch frames[1]
Accurate?
Chuck table
6 inch porous chuck table[1]
Accurate?

Optics & imaging4

Automatic micro-alignment with high magnification microscope[1]
Accurate?
Micro – magnification 7.5x1/2 CCD (field of view 0,64mm)[1]
Accurate?
Microscope magnification
7.5x with 1/2 inch CCD, field of view 0.64 mm[1]
Accurate?
Z-axis moving resolution
0.000002 mm[2]
Accurate?

Performance2

Y-axis positioning accuracy
0.005 mm / 160 mm (single error)[2]
Accurate?
Z-axis repeatability accuracy
0.001 mm[2]
Accurate?

Control & software1

15” LCD Monitor and graphical user interface (GUI)[1]
Accurate?

Dimensions & facilities4

Machine dimensions
490mm x 870mm x 1.670mm[1]
Accurate?
Equipment dimensions
490 mm × 870 mm × 1,670 mm[1]
Accurate?
Machine dimensions (W×D×H)
490 mm × 870 mm × 1,670 mm[2]
Accurate?
Machine weight
approx. 420 kg[2]
Accurate?

Configuration & options26

Power
2000W synchro spindle (3.000 – 40.000 rpm)[1]
Accurate?
Spindle shaft lock function for easier blade change[1]
Accurate?
USB memory[1]
Accurate?
Auto-Kerf-Check Function[1]
Accurate?
Auto Focus[1]
Accurate?
Automatic light intensity adjustment[1]
Accurate?
LED light as direct light source[1]
Accurate?
Pattern recognition system[1]
Accurate?
CE marking[1]
Accurate?
Make
Disco[1]
Accurate?
Model
DAD 3221[1]
Accurate?
Machine type
Automatic Dicing Saw[1]
Accurate?
Spindle layout
Single[2]
Accurate?
Spindle output
2000 W synchro spindle[1]
Accurate?
Spindle speed range
3,000–40,000 rpm[1]
Accurate?
Max workpiece size
Φ6 inch; optional 150 mm × 150 mm user-specified specification[2]
Accurate?
X-axis cutting range
160 mm[2]
Accurate?
Y-axis cutting range
162 mm[2]
Accurate?
CE marking
2022[1]
Accurate?
Spindle speed range
3,000 – 40,000 min⁻¹ (standard); 6,000 – 60,000 min⁻¹ (option)[2]
Accurate?
Z-axis max stroke
32.2 mm (for 2 inch blades)[2]
Accurate?
θ-axis max rotating angle
320 deg[2]
Accurate?
Max workpiece size
6 inch (150 mm) diameter; 150 mm × 150 mm square (option)[2]
Accurate?
LCD monitor
15 inch[1]
Accurate?
X-axis cutting speed
0.1 – 800 mm/s[2]
Accurate?
Y-axis index step
0.0001 mm[2]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationCondition monitoring function (spindle rpm, spindle current, vacuum, air pressure, etc. are displayed on the touch panel monitor)[1]
  • ConfigurationAutomatic lens shutter with air pressure blow[1]
  • ConfigurationInternal transformer, 380-420V, 3 phases, 50 Hz[1]
  • Internal transformer / power380–420 V, 3 phases, 50 Hz[1]
  • Spindle power2.0 kW (standard), 1.8 kW (option)[2]
  • Power supply380-420 V, 3 phases, 50 Hz (internal transformer)[1]
  • Rated torque (2.0 kW spindle)0.48 N·m[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the maximum workpiece size for the DAD 3221?

The DAD 3221 can handle wafers up to 6 inches (150 mm) in diameter, and up to 150 mm square with a user-specified specification.[1][2]

Does the DAD 3221 support automatic alignment and focus?

Yes, the DAD 3221 includes automatic calibration, automatic focus, and automatic kerf check functions.[1][2]

What is the X-axis cutting speed range of the DAD 3221?

The X-axis cutting speed range is 0.1 to 800 mm/s.[2]

Not publicly documented

The following facts about the DAD 3221 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 3221 Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD 3221 Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD 3221 Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD 3221 Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD 3221 Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]web.archive.org — disco.co.jp (Apr 11, 2026)web.archive.org
  3. [3]Equipment inventory listing
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Last updated Oct 1, 2026.

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