Waferpedia

Disco

DAD 321 Semi-Automatic Dicing

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

DAD 321 Semi-Automatic Dicing — Inventory photo
Fig. 01DAD 321 Semi-Automatic DicingInventory photo[1]

What it is

The Disco DAD 321 is a semi-automatic dicing saw.[1]

How it works

General reference — not yet source-verified

A dicing saw operates by using a rotating blade with diamond abrasive to cut along predetermined lines on a wafer. Semi-automatic operation means the machine handles the cutting cycle automatically but requires manual intervention for loading and unloading workpieces.

Where it fits in the process flow

General reference — not yet source-verified

Dicing is typically performed after wafer thinning and before die sorting or packaging. The process separates the wafer into individual chips that then undergo subsequent assembly steps.

Applications

General reference — not yet source-verified

The machine is used to cut semiconductor wafers made of materials such as silicon, gallium arsenide, or silicon carbide for integrated circuits, memory devices, and other microelectronic components.

What do the numbers mean?

Configuration & options4

OEM
Disco[1]
Accurate?
Model
DAD 321[1]
Accurate?
Type
Semi-Automatic Dicing Saw[1]
Accurate?
Vintage year
2003[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the model of the dicing saw?

The model is Disco DAD 321.[1]

Is the dicing saw fully automated?

No, it is semi-automatic.[1]

Not publicly documented

The following facts about the DAD 321 Semi-Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 321 Semi-Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD 321 Semi-Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD 321 Semi-Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD 321 Semi-Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD 321 Semi-Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Oct 8, 2026.

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