Waferpedia

Disco

DAD 321 Automatic Dicing

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Disco DAD 321 is an automatic dicing saw manufactured by Disco.[1][2]

DAD 321 Automatic Dicing — Inventory photo
Fig. 01DAD 321 Automatic DicingInventory photo[3]

What it is

The Disco DAD 321 is an automatic dicing saw. The machine is designed for dicing semiconductor wafers.[1][2]

How it works

General reference — not yet source-verified

Automatic dicing saws separate a wafer into individual dice by cutting along predefined streets with a high-speed rotating blade. The wafer is mounted on a dicing tape and held on a vacuum chuck that moves under the blade along a programmed cutting path. A spindle motor rotates the blade at a controlled speed while a coolant stream—typically deionized water—removes cutting debris and dissipates heat. An optical alignment system locates fiducials or pattern features on the wafer to correct for rotation and offset before cutting begins. After each cut, the stage indexes to the next street; multiple blades and cutting passes can be programmed for different material layers.

What do the numbers mean?

Power & electrical2

Voltage
200 VAC[3]
Accurate?
Phase
3 Phase[3]
Accurate?

Configuration & options1

Vintage year
1999[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage200 VAC[3]
  • Phase3 Phase[3]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the DAD 321 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 321 Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD 321 Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD 321 Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD 321 Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD 321 Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]DAD 321 Automatic Dicing — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
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Last updated Oct 1, 2026.

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