CEE
1300 X Hot Plate
The CEE 1300 X Hot Plate is a hot plate for 3, 4, 5, 6, and 8 inch wafers. The CEE 1300 X Hot Plate features vacuum and exhaust, programmable bake processing, a lift pin, and contact, vacuum contact, nitrogen purge, and proximity modes.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
What do the numbers mean?
Vacuum & pumping4
Wafer handling1
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the CEE 1300 X Hot Plate handle?
The CEE 1300 X Hot Plate handles 3 inch, 4 inch, 5 inch, 6 inch, and 8 inch wafers.[1][2][3]
What process modes does the CEE 1300 X Hot Plate support?
The CEE 1300 X Hot Plate supports contact, vacuum contact, nitrogen purge, and proximity modes.[1][2]
Does the CEE 1300 X Hot Plate have vacuum and exhaust capability?
Does the CEE 1300 X Hot Plate include lift pin handling?
Not publicly documented
The following facts about the 1300 X Hot Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1300 X Hot Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1300 X Hot Plate are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1300 X Hot Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1300 X Hot Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1300 X Hot Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]1300 X Hot Plate — CEE | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Cee 1300 X Hot Plate for 3-8 Inch Wafer Sizes — spwindustrial.comspwindustrial.com
Last updated Oct 6, 2026.