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Besi

2200 EVO Tool Holder

Besi 2200 EVO Tool Holder family
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The Besi 2200 EVO Tool Holder is a tool holder for the Datacon 2200 EVO die bonder.[1]

Besi2200 EVO Tool Holder
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Performance

±10 µm @ 3σ[2]

Optics

365 nm and 405 nm[2]

What it is

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed for multi-module attach processes.[2][4]

The Datacon 2200 evo advanced variant offers a placement accuracy of ±3 µm at 3 sigma for X/Y placement.[4]

The base Datacon 2200 evo variant has an X/Y placement accuracy of ±10 µm at 3 sigma.[2][3]

How it works

The Datacon 2200 evo uses a multi-module architecture that allows up to four working heads to operate within a single machine.[2][4]

The machine features automatic tool changing and an integrated dispenser, supporting multiple dispensing methods including auger pump, time pressure dispensing, and piezo jetter valves.[2][4]

The Datacon 2200 evo offers both a standard bond head with 0 to 360 degree rotation and an optional heated bond head capable of temperatures up to 450 degrees Celsius.[2][4]

Where it fits in the process flow

The Datacon 2200 evo is capable of handling multiple die attach and flip chip processes in a single pass, making it suitable for complex multi-chip packages.[2][4]

Applications

The Datacon 2200 evo is used for die attach and flip chip processes in the assembly of multi-chip modules, system-in-package devices, and hybrid circuits.[2][4]

The machine supports a variety of component presentations including wafers, waffle packs, Gel-Pak, JEDEC trays, and feeders, and can place die onto substrates such as FR4, ceramic, BGA, flex, boat, lead frame, and wafer.[2][4]

The Datacon 2200 evo can process both hot and cold bonding processes including epoxy, soldering, and thermo-compression bonding.[2]

What do the numbers mean?

Wafer handling3

Wafer Size
4" - 12" (SEMI M1)[2]
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Substrate Working Range
13" x 8" (325 mm x 200 mm)[2]
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Wafer handling
12" wafer handling[2]
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Optics & imaging1

UV Curing Wavelengths
365 nm and 405 nm[2]
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Performance2

X/Y Placement Accuracy
±10 µm @ 3σ[2]
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Theta Placement Accuracy
±0.15° @ 3σ[2]
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Dimensions & facilities2

Machine Dimensions (LxDxH)
1,160 mm x 1,225 mm x 1,750 mm[2]
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Machine Weight
1,300 kg[2]
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Configuration & options20

Make
Besi / Datacon[1]
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Model
2200 EVO Tool Holder[1]
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Asset Number
83809[1]
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Bond Force Range
0.5N to 75N programmable[2]
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UPH Die Attach
up to 7,000 UPH/module[2]
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UPH Flip Chip with dipping
up to 2,500 UPH/module[2]
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UPH Flip Chip without dipping
up to 3,200 UPH/module[2]
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Uptime
> 98%[2]
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Yield
> 99.95%[2]
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Die Size (Die Attach)
0.17 mm - 50 mm[2]
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Die Size (Flip Chip)
0.5 mm - 50 mm[2]
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Die Thickness
>50 µm (thinner on request)[2]
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Frame Size
FF070, FF105, FF108, FF123; automatic change (others on request)[2]
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Bond Head Rotation
0° to 360°[2]
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Heated Bond Head (optional)
up to 450°C[2]
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Model
2200 EVO[1]
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Product type
Tool holder[1]
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Integrated dispenser
Included[2]
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Automatic tool changer
Included[2]
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Vintage
2010[3]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Datacon 2200 evo advanced——±3 µm placement accuracy (vs. ±10 µm on base model), new gantry and controller system, new vision and camera generationbesi.com[4]
Datacon 2200 evo plus———besi.com[4]
Datacon 2200 evo hF———besi.com[4]
Datacon 2200 evo hS———besi.com[4]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

How many pick-up tools can the Besi 2200 EVO Tool Holder accommodate?

The tool holder can accommodate up to 14 different pick-up tools or nozzles.[4]

How many eject tools does the tool holder support?

The tool holder supports up to 5 eject tools.[4]

Can the tool holder be used for both die attach and flip chip processes?

Yes, the Datacon 2200 evo die bonder that incorporates the tool holder is designed for both die attach and flip chip applications.[2]

Not publicly documented

The following facts about the 2200 EVO Tool Holder are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 EVO Tool Holder are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 2200 EVO Tool Holder are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 2200 EVO Tool Holder are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 2200 EVO Tool Holder is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 2200 EVO Tool Holder are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]besi.com — besi.combesi.com
  3. [3]solutions-on-silicon.com — solutions-on-silicon.comsolutions-on-silicon.com
  4. [4]besi.com — besi.combesi.com
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Last updated Sep 30, 2026.

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